Method for fabricating encased molded multi-chip module substrat

Details Method for fabricating encased molded multi-chip module substrat Method for fabricating encased molded multi-chip module substrat

1994-06-24

1996-02-20

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29841, 26427214, 26427215, 26427217, B32B 310

Patent

active

054925860

ABSTRACT:
A method for fabricating a multi-chip module substrate comprises providing a carrier having a well. Substrate molding material is poured into the carrier well. A plurality of chips is situated in the substrate molding material. A laminatable dielectric layer is laminated over the substrate molding material at a predetermined temperature and a predetermined pressure so that the substrate molding material flows and encapsulates the chips.

REFERENCES:
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patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4913930 (1990-04-01), Getson
patent: 5032543 (1991-07-01), Black et al.
patent: 5041396 (1991-08-01), Valero
patent: 5063177 (1991-11-01), Geller et al.
patent: 5149387 (1992-09-01), Moore, Sr.
patent: 5224265 (1993-07-01), Dux et al.

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