Printed wiring board with electromagnetic wave shielding layer

Details Printed wiring board with electromagnetic wave shielding layer Printed wiring board with electromagnetic wave shielding layer

1992-02-24

1993-05-11

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

29837, 361400, H05K 0100

Patent

active

052103790

ABSTRACT:
A printed wiring board has an electromagnetic wave shielding layer. The printed wiring board includes a printed circuit formed on a substrate. Stratified layers of insulation are formed over the printed circuit. The insulation layers are disposed so as to form a bowl-shaped connection region. A terminal may be formed simultaneously with the forming of the electromagnetic wave shielding layer to provide a connection between the electromagnetic shielding layer and the printed circuit. The bowl-shaped connecting region provides for smoothly filling the terminal with a conductor paste without the occurrence of foaming or blurring during, for example, a silk screening printing process.

REFERENCES:
patent: 4789760 (1988-12-01), Koyama
patent: 4801489 (1989-01-01), Nakagawa
patent: 5030800 (1991-07-01), Kawakami
patent: 5043526 (1991-08-01), Nakagawa

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