Geometrical instruments
Patent
1985-02-14
1987-03-24
Abrams, Neil
Geometrical instruments
29830, 338308, 361414, H01R 909
Patent
active
046520651
ABSTRACT:
A semiconductor termination socket for use with a printed wiring board has a mounting socket base for attachment to the board and plural pin socket receiving elements in the base for connecting to leads of a semiconductor chip package which will be removably inserted into the socket. The socket further has electrical components fabricated within the socket base for connecting a pin of the socket and a termination potential. The electrical components are preferably fabricated using planar technology so that the socket becomes, in essence, a printed wiring board. The semiconductor packages can be of any configuration including, for example, 149 pin grid array packages. If more than one layer of component circuitry is needed, a plurality of layers can be embedded within the mounting socket.
REFERENCES:
patent: 3365620 (1968-01-01), Butler et al.
patent: 3418535 (1968-12-01), Martinell
patent: 3588616 (1971-06-01), Palazzini
patent: 3964087 (1976-06-01), Mallon
patent: 4342069 (1982-07-01), Link
patent: 4407007 (1983-09-01), Desai et al.
IBM Bulletin, Fedrowitz et al., vol. 20, No. 12, p. 5172, 5-1978.
IBM Bulletin, Falda, vol. 23, No. 12, p. 5410, 5-1981.
Abrams Neil
Prime Computer Inc.
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