Abrading – Abrading process – With tool treating or forming
Patent
1996-11-05
1998-03-10
Morgan, Eileen P.
Abrading
Abrading process
With tool treating or forming
451 57, 451287, 451443, B24B 5300
Patent
active
057254176
ABSTRACT:
A method and apparatus for conditioning a planarizing surface of a polishing pad used to planarize a semiconductor wafer or other substrate. In one embodiment of the invention, a fixed-abrasive polishing pad having a suspension medium and a plurality of abrasive particles fixedly dispersed within the suspension medium, is conditioned by: forming a discreet stratum from the suspension medium at the surface of the planarizing surface; and removing the discreet stratum from the planarizing surface to form a newly exposed planarizing surface across the polishing pad. The suspension medium is preferably substantially insoluble in a wash fluid, while the discreet stratum is preferably soluble in the wash fluid. In a preferred embodiment, the discrete stratum is formed by diffusing a conditioning solution into the suspension medium that changes the suspension medium from being substantially insoluble in the wash fluid to being soluble in the wash fluid. The discreet stratum is then preferably removed from the planarizing surface by dissolving the discreet stratum in the wash fluid. Accordingly, the soluble stratum is selectively removed from the surface of the wafer to form a new, uniformly abrasive planarizing surface.
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Micro)n Technology, Inc.
Morgan Eileen P.
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