Method for making custom integrated circuits and metallization a

Details Method for making custom integrated circuits and metallization a Method for making custom integrated circuits and metallization a

1981-05-06

1982-09-07

Herbert, Jr., Thomas J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

357 40, 357 51, 427 96, 427272, 427282, 428457, 428901, B32B 300, B05D 512, B32B 1504, H01L 2702

Patent

active

043484514

ABSTRACT:
Integrated circuit semiconductor wafers are prepared through diffusions, depositing a protective glass layer, opening holes in the glass layer exposing component contact areas. The wafers are stored. Partially complete metallization artwork is prepared by using the normal cut-and-strip technique, whereby the interconnections between component elements are essentially unaccounted for in this artwork. A circuit design engineer completes the artwork by using opaque adhesive tape to represent the interconnections of his circuits. Besides providing practical means by which such designers may fully participate in deciding upon layout and circuit realization tradeoffs with the IC manufacturer, this invention provides a shorter faster process at lower cost than by conventional procedures.

REFERENCES:
patent: 4244125 (1981-01-01), Corey
California Devices, Inc., Create Your Own Integrated Circuit.
F. E. Barrows et al., Electronics, "Photography Speeds Printed Circuit Design", pp. 102, 104, 105 (1961).
Exar, Linear and Digital Semi-Custom IC Design Programs, Mar. 1981.
Monosil, Monologic.TM., A Cost-effective Way to Speed Your Custom CMOS I.C. Development Using Predesigned Gate Arrays.

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