Heat dissipation structure for electronic equipment including tw

Details Heat dissipation structure for electronic equipment including tw Heat dissipation structure for electronic equipment including tw

1998-09-02

2000-07-25

Feild, Lynn D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361704, G06F 120, H05K 720

Patent

active

060943432

ABSTRACT:
A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case. In addition, another heat dissipation block is interposed between a keyboard and the daughter board so that another heat dissipation path can be formed through the central processing unit, another heat dissipation block, another heat dissipation plate, and the keyboard.

REFERENCES:
patent: 5424913 (1995-06-01), Swindler
patent: 5557500 (1996-09-01), Baucom et al.
patent: 5581443 (1996-12-01), Nakamura et al.

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