Lead frame having projections for resin molding

Details Lead frame having projections for resin molding Lead frame having projections for resin molding

1988-12-12

1990-01-16

Davie, James W.

357 72, H01L 2348, H01L 2328

Patent

active

048947040

ABSTRACT:
A lead frame comprising an inner lead part to be electrically connected to an internal device and contained within a mold cavity for being resin molded, and an outer lead part connected to the inner lead part, the inner lead part having a projection with which a resin flow having passed through a mold gate collides. Because the resin flowing through the mold gate collides with the projection near a cavity inlet and disperses, the molding resin can reach corners near the cavity inlet, and air can be purged off from the corners to obtain a no-void, satisfactory appearance of semiconductor package.

REFERENCES:
patent: 4575748 (1986-03-01), Terui et al.

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