Arrangement for high-frequency opaque shielding

Details Arrangement for high-frequency opaque shielding Arrangement for high-frequency opaque shielding

1998-10-02

2000-07-25

Reichard, Dean A.

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

H05K 900

Patent

active

060938870

ABSTRACT:
The invention relates to an arrangement for high-frequency opaque shielding of walls, or portions thereof, of a housing, wherein the walls or their portions include a plate-form basic element (12) having a shielding function, with, if appropriate, wall prongs (16) projecting from these into the housing, and wherein in at least one side margin region (14) extending perpendicularly to the front face (18) of the basic element, extend a first groove (20) with sidewall (24, 26) disposed in the proximity of or remote from the front face as well as a groove bottom (28) into which a first prong (42), U-form in section, of a spring element (40) can be emplaced which with a further prong (48) extends in regions along the side margin region. Independently of whether or not the basic element is a sheet panel or a profiled panel with wall prongs, it is suggested that, in order to secure a spring element in the first groove (20) extending in the side margin region (14) the first prong (42), U-form in section, of the spring element (40) can be snapped in.

REFERENCES:
patent: 4572921 (1986-02-01), May et al.
patent: 4803306 (1989-02-01), Malmquist
patent: 4879434 (1989-11-01), Assel et al.
patent: 5029254 (1991-07-01), Stickney
patent: 5313016 (1994-05-01), Brusati et al.

Affiliated with

Also associated with

Rating

Arrangement for high-frequency opaque shielding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Arrangement for high-frequency opaque shielding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Arrangement for high-frequency opaque shielding will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1337953