Metal fusion bonding – Process – Bonding nonmetals with metallic filler
Patent
1993-12-30
1996-04-09
Heinrich, Samuel M.
Metal fusion bonding
Process
Bonding nonmetals with metallic filler
228174, 228254, B23K 3102
Patent
active
055053645
ABSTRACT:
Disclosed are an ink jet printhead and method of manufacturing the same. The method of manufacturing comprises the steps of: (1) coating a substantially flat lower surface of an upper piezoelectric member with a first conductive coating, (2) coating a substantially flat upper surface of a lower piezoelectric member with a second conductive coating, (3) depositing a conductive solder over the first conductive coating, (4) forming a first elongated indentation in the lower surface, the first indentation extending through the first coating and into the upper member, (5) joining the solder with the second conductive coating by placing the upper piezoelectric member over the lower piezoelectric member, (6) heating the upper and lower piezoelectric members to thereby melt the solder and (7) cooling the solder, the solder electrically and mechanically joining the first coating to the second coating, the first indentation and the upper surface thereby forming the channel, the channel capable of containing ink and capable of ejecting ink therefrom when an electric current distorts the upper and lower piezoelectric members.
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Compaq Computer Corporation
Heinrich Samuel M.
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