Chemistry: electrical and wave energy – Processes and products
Patent
1988-10-31
1990-01-16
Niebling, John F.
Chemistry: electrical and wave energy
Processes and products
204371, 204 384, C25D 554
Patent
active
048941247
ABSTRACT:
Both surfaces of a uniformly and completely textured polyimide sheet are coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers are strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion, as well as a modification of IPC test 2.4.9 method E for resistance to thermal cycling.
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Knudsen Philip D.
Walsh Daniel P.
Cook Paul J.
Leader William
Niebling John F.
Polyonics Corporation
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