Wiring structure having rotated wiring layers

Details Wiring structure having rotated wiring layers Wiring structure having rotated wiring layers

1997-02-28

2000-03-28

Kincaid, Kristine

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174 36, 174261, H05K 100

Patent

active

060434368

ABSTRACT:
An improved wiring structure to minimize coupling between the wiring in one metalization layer of an integrated circuit chip and the wiring in an adjoining metalization layer is described. Wiring in one layer is rotated by an angle a.sub.1 with respect to the direction of the wiring in the adjoining layer. By successively rotating all the conductors of one wiring layer with respect to the wiring of the next layer, the capacitive and inductive coupling between conductors in the various layers is minimized, thereby improving the overall high-frequency performance of the chip.

REFERENCES:
patent: 4782193 (1988-11-01), Linsker
patent: 4785135 (1988-11-01), Ecker et al.
patent: 5742086 (1998-04-01), Rostoker et al.

Affiliated with

Also associated with

Rating

Wiring structure having rotated wiring layers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wiring structure having rotated wiring layers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring structure having rotated wiring layers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1327385