Thermal head with buckling exothermic resistor and manufacturing

Details Thermal head with buckling exothermic resistor and manufacturing Thermal head with buckling exothermic resistor and manufacturing

1996-10-18

1999-07-20

Tran, Huan

Incremental printing of symbolic information

Thermal marking apparatus or processes

Specific resistance recording element type

B41J 2335

Patent

active

059261994

ABSTRACT:
A pair of opposite end portions of a buckling exothermic body as an exothermic resistor are fixed onto a substrate via insulating members. The buckling exothermic body heats with resistance thereof by applying a voltage from a power source to the buckling exothermic body via a switch. As inner temperature of the exothermic resistor reaches a predetermined temperature or higher required for the exothermic resistor to buckle, and a compressive force exceeds a buckling load, the exothermic resistor buckles and distorts towards thermosensible paper from a non-shifted state in which there is virtually no thermal stress. As the buckled and distorted exothermic resistor comes into contact with the thermosensible paper, recording, such as printing, is performed only at the contact portion. This reduces thermal mutual interference between neighboring buckling exothermic bodies. As a result, recording of high resolution and high print quality is performed. Moreover, since, unlike the prior art, there is no need to provide an abrasion protection layer, production costs can be cut down and a smaller and lighter head can be made.

REFERENCES:
patent: 5666141 (1997-09-01), Matoba et al.
patent: 5684519 (1997-11-01), Matoba et al.
Iwamoto, "Solid-Melting Ink Type (Thermal Transfer) Printer", Photographic Engineering, Special Issue on Imaging, Part 2, published on Jul. 20, 1988, pp. 65-73.
Hayama, "Thermal Head Array", Photographic Engineering, Special Issue on Imaging, Part 3, published on Dec. 20, 1988, pp. 45-54).

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