Small size semiconductor package

Details Small size semiconductor package Small size semiconductor package

1997-07-30

2000-03-28

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438111, 438112, 257670, 257674, 257676, H01L 2144

Patent

active

060431113

ABSTRACT:
A semiconductor package for a bipolar transistor comprises a lead frame including a plurality of inner leads arranged in a resin mold package. The inner leads include a collector lead mounting thereon a transistor element and occupying substantially the upper half area of the package, a base lead located at a central part of the lower half area, and an emitter lead extending between the spaces between the collector lead and base lead for improvement of transistor characteristics in a high frequency range. The gap (0.2 mm) between the leads is smaller than the thickness (0.26 mm) of the lead frame for reduction of package size. After punching press of the metallic plate, the metallic pattern plate is subjected to press-bending and/or non-press bending technique for reducing the gap between the lead portions of the lead frame.

REFERENCES:
patent: 4012765 (1977-03-01), Lehner et al.
patent: 4631805 (1986-12-01), Olsen et al.
patent: 5334553 (1994-08-01), Popat et al.
patent: 5512781 (1996-04-01), Inoue
patent: 5530284 (1996-06-01), Bailey
patent: 5705431 (1998-01-01), Mori
patent: 5766985 (1998-06-01), Mangiagli et al.
patent: 5792676 (1998-08-01), Masumoto et al.
patent: 5859387 (1999-01-01), Gagnon

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