Method for manufacturing a panel switch attached to electronic a

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156292, 156277, 156282, 156291, 1563317, 156332, 156333, 156334, 200513, 29882, 29883, 29885, B32B 3100

Patent

active

053585798

ABSTRACT:
A method for manufacturing a panel switch comprises of the steps of respectively mixing first and second adhesives which have no adhesive quality at a room temperature and have adhesive quality at a moderate temperature, printing an upper contacting point on one side of an upper sheet, printing the first adhesive on one side of the upper sheet to surround he upper contacting point, transforming the upper contacting point in a hemisphere form swelling toward the upper sheet;, printing a lower contacting point on one side of a lower sheet, printing the second adhesive on another side of the lower sheet, assembling a reinforcing plate, the lower sheet and the upper sheet in that order for the upper contacting point to face the lower contacting point, and simultaneously heating both the first adhesive layer and the second adhesive layer. In this case, the upper sheet is adhered to the lower sheet through the first adhesive, and the lower sheet is adhered to the reinforcing plate through the second adhesive.

REFERENCES:
patent: Re22301 (1943-04-01), Pitman
patent: 3022814 (1962-02-01), Bodine, Jr.
patent: 3528867 (1970-09-01), Leatherman
patent: 3886012 (1975-05-01), Slater
patent: 4137116 (1979-01-01), Miller
patent: 4315793 (1982-02-01), Off et al.
patent: 4382165 (1983-05-01), Balash et al.
patent: 5136131 (1992-08-01), Komaki

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