Terminal structure for electronic part with stepped offset porti

Details Terminal structure for electronic part with stepped offset porti Terminal structure for electronic part with stepped offset porti

1996-12-10

1999-03-09

Kincaid, Kristine

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257696, 361773, H02G 308

Patent

active

058804056

ABSTRACT:
A terminal structure for a surface mount electronic part including a terminal holding member formed from a synthetic resin, and external terminal extending from the terminal holding member for soldering to soldering lands of a printed wiring board. Each of the external terminals is held on the terminal holding member such that a straight portion projects laterally from the terminal holding member and is restricted direction (i.e., in width and thickness directions). The outermost tip portion of each external terminal includes an offset portion which is stepped downwards relative to the straight portion of the external terminal includes an offset portion which is stepped downwards relative to the straight portion of the external terminal and which is formed by half punching. The offset portion is provided for soldering to a soldering land of the printed wiring board. A region of the lower surface of the offset portion of each external terminal, which is continuous with a front end surface of the offset portion, is beveled to form an inclined surface such that the thickness of the offset portion decreases toward the front end surface.

REFERENCES:
patent: 5291375 (1994-03-01), Mukai
patent: 5367124 (1994-11-01), Hoffman et al.
patent: 5406119 (1995-04-01), Numada
patent: 5456610 (1995-10-01), Banakis et al.

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