Methods for measuring image-formation characteristics of a proje

Details Methods for measuring image-formation characteristics of a proje Methods for measuring image-formation characteristics of a proje

1997-03-25

1999-11-16

Young, Christopher G.

Radiation imagery chemistry: process, composition, or product th

Registration or layout process other than color proofing

430 30, G03F 900

Patent

active

059854952

ABSTRACT:
Methods and apparatus are disclosed for exposing a reticle pattern onto a sensitive substrate (such as a sensitized semiconductor wafer) by projection-exposure at high focusing precision. According to the method, multiple evaluation marks are projected onto an area of the surface to form images of the evaluation marks. An image of a measurement mark is projected on or near at least some of the evaluation marks. Respective Z-direction displacements of each evaluation mark relative to a reference plane are detected by detecting a characteristic of the respective measurement mark that varies with a change in position of the measurement mark relative to the respective evaluation mark. Based on such measurements, an axial relationship of the projection-optical system relative to the substrate can be changed to place the substrate at a best-focus position before exposing the substrate with a reticle pattern. Associated apparatus are also disclosed.

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