Method of thermal treatment of a wafer in an evacuated environme

Details Method of thermal treatment of a wafer in an evacuated environme Method of thermal treatment of a wafer in an evacuated environme

1987-07-10

1988-05-10

Roy, Upendra

Fishing, trapping, and vermin destroying

148DIG83, 250398, 2504921, 357 91, 427 38, 437 20, 437 82, H01L 21263

Patent

active

047435704

ABSTRACT:
In a vacuum chamber wafer treating apparatus a wafer is heated or cooled by introducing a gas at a pressure of approximately 100 to 1000 microns in a region between the wafer and a heating element or heat sink. The gas conducts thermal energy between the wafer and heating element or heat sink.

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