Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Patent
1997-09-30
1999-11-16
Gorgos, Kathryn
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
204224R, 204297R, 205157, C25D 712, C25D 1706
Patent
active
059851260
ABSTRACT:
A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrode assemblies which have a contact part which connects to a distal end of an electrode shaft and bears against the workpiece and conducts current therebetween. The contact part is preferably made from a corrosion resistant material, such as platinum. The electrode assembly also preferably includes a dielectric layer which covers the distal end of the electrode shaft and seals against the contact part to prevent plating liquid from corroding the joint between these parts.
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Bleck Martin C.
Graham Lyndon W.
Hanson Kyle M.
Gorgos Kathryn
Leader William T.
Semitool Inc.
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