Nickel or nickel alloy electroplating bath and plating process u

Details Nickel or nickel alloy electroplating bath and plating process u Nickel or nickel alloy electroplating bath and plating process u

1997-10-21

1999-11-16

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205125, 205135, 205219, 205255, 205271, C25D 312, C25D 502

Patent

active

059851244

ABSTRACT:
Disclosed is a nickel electroplating bath or a nickel alloy electroplating bath used for electroplating a conductor partially masked with an organic high-molecular resist layer, wherein the nickel electroplating bath contains a water-soluble nickel salt, and the nickel alloy electroplating bath contains both a water-soluble nickel salt and a water-soluble salt of a metal capable of being alloyed with nickel. The above electroplating bath is incorporated with an electrical conductive salt containing at least one cation selected from the group consisting of an ammonium ion, magnesium ion, calcium ion, aluminum ion, and barium ion. Further, the electrical conductive salt substantially does not contain a sodium ion and a potassium ion as cations. Such an electroplating bath is capable of electroplating a conductor partially masked with an organic high-molecular resist layer without floating of the resist layer.

REFERENCES:
patent: 4190474 (1980-02-01), Berdan et al.
patent: 4224115 (1980-09-01), Nara et al.
patent: 4290858 (1981-09-01), Engelhaupt
patent: 4518467 (1985-05-01), Mason et al.
patent: 4891480 (1990-01-01), Holden, Jr. et al.
patent: 4892628 (1990-01-01), Guilinger

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