Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-10-06
1999-07-20
Crispino, Richard
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156205, 156210, 156470, 156499, B31F 128
Patent
active
059252090
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
The invention relates to a process for producing corrugated board, as well as a device for carrying out this process.
It is known to produce corrugated board by bringing together a number of constituent webs together and gluing them to one another. For example, with a double-double corrugated board, three constituent webs, namely two constituent webs of unilateral corrugated board and one smooth cover web are brought together. It is known to supply these constituent webs to a single junction point at which a heating device possibly adjoins a conveyor belt. In this known manufacturing process, it is disadvantageous that the spacings between the adhesive application points for the constituent webs and the junction point for the constituent webs are unnecessarily great. The required heat entry into the constituent webs and the residual heat in the region of the junction point of the constituent webs is usually insufficient. Furthermore, the adhesive mechanisms and thus the adhesive application point are disposed spaced apart from the junction point of the constituent webs, independently of the web speed. With increased web speed, there is thus the danger that the moisture removal from the adhesive application is insufficient before the constituent webs reach the junction point. A favorable gluing together of the constituent webs then requires an unnecessarily long heating device via which the glued-together constituent webs must be guided. At a lower web speed, too much moisture is removed from the adhesive. The adhesion is inadequate.
SUMMARY OF THE INVENTION
The object of the invention is to establish a process and a device which make it possible to assure the optimal moisture removal from the constituent webs even at different web speeds and to assure the shortest possible spacing between the preheating device and the adhesive application point as well as between the adhesive application point and the junction point of the constituent webs. Furthermore, the device should have a compact design.
The invention attains the object of assuring the optimal moisture removal of the adhesive application even with changeable web speed by virtue of the fact that the spacing between the adhesive application point and the junction point is changed as a function of the web speed.
This achieves the advantage that for the optimal moisture removal, the spacing between the preheating device and the adhesive application point of the constituent web and the junction point of the constituent web can be selected to be as short as necessary, depending on the web speed. The heating device that adjoins the junction point of the constituent webs can then be kept as short as possible.
According to one embodiment of the invention, a number of constituent webs are conveyed to a single junction point. This produces a compact design of the device.
According to another embodiment of the invention, the adhesive mechanisms for the constituent webs are disposed one above the other. It is furthermore possible to more simply embody the movement or position changing of the adhesive mechanisms and therefore of the adhesive application point in relation to the junction point of the constituent webs. In order to achieve the most compact design possible and to thus achieve optimal spacings, a corresponding structure of the adhesive mechanisms is required.
In order to improve the heat entry into the constituent web or into the board web to be glued, the constituent webs are heated from both of their outer sides before and/or after the adhesive application.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention will be explained in detail below in conjunction with the accompanying drawing showing a side view schematic representation of the device for manufacturing a corrugated board web out of a number of constituent webs.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
The device 1 provides adhesive mechanisms 2, 3, preferably disposed one above the other. The adhesive mechanisms 2, 3 have a design that is not explained in de
REFERENCES:
patent: 782558 (1905-02-01), Hahn
patent: 1005836 (1911-10-01), Hinde
patent: 4059474 (1977-11-01), Coburn
patent: 5122220 (1992-06-01), Seki
BHS Corrugated Maschinen und Anlagenbau GmbH
Crispino Richard
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