Interconnection of a carrier substrate and a semiconductor devic

Details Interconnection of a carrier substrate and a semiconductor devic Interconnection of a carrier substrate and a semiconductor devic

1995-05-19

1996-09-10

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228175, 22818022, H01L 2150

Patent

active

055537693

ABSTRACT:
Solder interconnection for forming connections between an integrated semiconductor device and a carrier substrate is provided. Located on the carrier substrate are electrodes and located between the electrodes and integrated semiconductor device are solder connections that have a relatively low melting point such that when the device is in operation, the solder connection will liquify thereby permitting expansion compensation between the substrate and semiconductor device.

REFERENCES:
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4999699 (1991-03-01), Christie et al.
patent: 5007163 (1991-04-01), Pope et al.
patent: 5170930 (1992-12-01), Dolbear et al.
patent: 5391514 (1995-02-01), Gall et al.

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