Resin composition

Details Resin composition Resin composition

1992-10-29

1995-06-13

Schofer, Joseph L.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Polymers from only ethylenic monomers or processes of...

526348, 525217, C08F22240, C08F21000, C08L 3900

Patent

active

054243807

ABSTRACT:
Resin compositions having excellent heat resistance, izod impact strength, rigidity and dimensional resistance and the like, applied in the fields of the automobile, electric and electronic, and the like industries. The resin composition comprising: a) a resin in which 30 to 98 mole % of the component (I) are contained in the whole polymer and 70 to 2 mole % of the component (II) are contained in the whole polymer, its weight-average molecular weight converted into that of polystyrene being 1.times.10.sup.3 or more to 5.times.10.sup.6 or less, and b) an olefin resin; then the a)/b) content being 5/95 to 99/1 as a weight ratio, ##STR1## wherein R.sub.1 is an alkyl group having 1 to 18 carbon atom(s) or a cycloalkyl group having 3 to 12 carbon atoms; and ##STR2## wherein R.sub.2 is hydrogen or an alkyl group having 1 to 8 carbon atom(s), and R.sub.3 and R.sub.4 is an alkyl group having 1 to 8 carbon atoms.

REFERENCES:
patent: 4386176 (1983-05-01), Fukuda et al.
patent: 5208307 (1993-05-01), Doi et al.
Abstract of JP 59-011322.
Abstract of JP 4-031407.
Abstract of JP 4-031408.
Abstract of JP 4-053810.

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