Method of making mold-packaged pressure sensing semiconductor de

Details Method of making mold-packaged pressure sensing semiconductor de Method of making mold-packaged pressure sensing semiconductor de

Filed on

1993-12-15

Date issued

1995-06-13

Examiner

Chaudhuri, Olik

Patent Class

Fishing, trapping, and vermin destroying

Other Related Categories

437209, 437217, 437219, 437220, 437974, 257787, H01L 2156

Type

Patent

Status

active

Patent number

054242495

Description

ABSTRACT:
A pressure sensor element (50) is bonded to a die bonding pad (4). The pressure sensor element (50) is thereafter entirely covered with epoxy resin (11) and completely packaged. Following this, the epoxy resin (11) is locally removed at a portion above a diaphragm (5) of the pressure sensor element (50). As a result, the diaphragm (5) is exposed. In this method, the diaphragm (5) is uncovered without using a special metallic mold which prohibits the epoxy resin (11) from flowing into a space above the diaphragm (5). A gold wire (8) is also molded by the package sealing. Thus, a resulting package-molded pressure sensing semiconductor device is highly reliable under adverse environmental conditions and considerably cost-effective.

REFERENCES:
patent: 4188708 (1980-02-01), Frederiksen
patent: 4691575 (1987-09-01), Sonderegger et al.
patent: 4823605 (1989-04-01), Stein
patent: 4838089 (1989-06-01), Okada et al.
patent: 5209120 (1993-05-01), Araki

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