Process for photoformed plastic multistrate using two layer film

Details Process for photoformed plastic multistrate using two layer film Process for photoformed plastic multistrate using two layer film

1984-10-26

1986-01-28

Goodrow, John L.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427436, 430315, 430319, H05K 318

Patent

active

045670625

ABSTRACT:
Process for preparing multilayer printed circuits comprising laminating simultaneously or sequentially to a substrate bearing a circuit pattern two photopolymerizable layers, the lower layer formulated for bulk response as defined and the upper layer formulated for surface response as defined; exposing the laminate to actinic radiation through a circuit image related to the circuit pattern on the substrate; embedding finely divided metal, e.g., copper, to the tacky image areas; exposing the toned laminate to actinic radiation through an image of at least one overlying segment of the conductive circuit pattern; removing unexposed photopolymer from the two layers to form vias; embedding finely divided metal, e.g., copper, or catalyst to the side walls of the vias; optionally, curing the image by exposing to actinic radiation and/or by heating; plating to form an interconnected electrically conductive circuit. Additional circuit layers can be added by repeating the process using the newly plated circuit pattern as a substrate.

REFERENCES:
patent: 4157407 (1979-06-01), Peiffer
patent: 4329620 (1982-09-01), Cyr et al.
patent: 4360570 (1982-11-01), Andreades et al.
patent: 4454168 (1984-06-01), Fritz

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