Etching apparatus

Details Etching apparatus Etching apparatus

1989-11-08

1990-11-06

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

134 32, 134198, 156640, 156657, 156662, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

049683756

ABSTRACT:
A semiconductor substrate etching apparatus is disclosed. In this apparatus, a semiconductor substrate is mounted on the upper surface of a first vacuum chuck, an etching solution is supplied to a groove of a roller of a semiconductor substrate end surface etching mechanism, which covers the end surface of the semiconductor substrate, and the first vacuum chuck and the roller are rotated in the opposite directions. The end surface of the semiconductor substrate is brought into contact with the etching solution. The etching solution is then transferred onto the end surface of the substrate, thus performing etching of the end surface.

REFERENCES:
patent: 4339297 (1982-07-01), Aigo
patent: 4350562 (1982-09-01), Bonu

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