Adhesive bonding and miscellaneous chemical manufacture – Methods
Patent
1973-08-20
1976-05-11
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
96 351, 96115R, 156 13, 156 18, G03C 168
Patent
active
039560430
ABSTRACT:
A process for the manufacture of printed multilayer circuits by coating carrier films, which possess metal layers, with a light-sensitive material containing a compound with epoxide groups and with groups which can be cured by electromagnetic rays, by exposing the light-sensitive material through a transparent film which shows the negative image of the conductor traces to be produced, by developing with an organic solvent, by etching the metal layer and pressing the laminates together to form a multi-layer circuit. The parts of the light-sensitive layer which have been pre-cured by exposure to light are subjected to a thermal after-treatment using a curing agent for epoxide groups, whereby these parts are post-cured. These parts are not removed from the carriers films.
REFERENCES:
patent: 3295974 (1967-01-01), Erdmann
patent: 3418295 (1968-12-01), Schoenthaler
patent: 3484239 (1969-12-01), Steppan et al.
patent: 3497354 (1970-02-01), Steppan et al.
patent: 3539343 (1970-11-01), Munder et al.
patent: 3776729 (1973-12-01), Levy et al.
patent: 3876432 (1975-04-01), Carlick et al.
Losert Ewald
Remabold Heinz
Zahir Abdul-Cader
Cavalieri Vincent J.
Ciba-Geigy Corporation
Massie Jerome W.
Powell William A.
LandOfFree
Process for the manufacture of printed multi-layer circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for the manufacture of printed multi-layer circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the manufacture of printed multi-layer circuits will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1300568