Method for manufacturing an IC module for an IC card whereby an

Details Method for manufacturing an IC module for an IC card whereby an Method for manufacturing an IC module for an IC card whereby an

1992-01-06

1992-10-13

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437219, 437966, 437974, H01L 2152, H01L 2156, H01L 2160

Patent

active

051550687

ABSTRACT:
An IC card comprising a card body having a concave position provided on one of surfaces thereof and an IC module fitted into the concave portion, wherein the IC module includes a very thin LSI having an active device and metallic wire layers formed on a semiconductor substrate, electrodes for connection formed on the metallic wire layers, external connecting terminals having the electrodes for connection connected to the back faces thereof and a resin for fixing the very thin LSI onto the back faces of the external connecting terminals, and the semiconductor substrate of the very thin LSI substantially exists but is made thin like a film so that the IC module is very thin entirely.

REFERENCES:
patent: 3702464 (1972-11-01), Castrucci
patent: 4532419 (1985-07-01), Takeda
patent: 4603249 (1986-07-01), Hoppe et al.
patent: 4725924 (1988-02-01), Juan
patent: 4774633 (1988-09-01), Dehaine et al.
patent: 4803542 (1989-02-01), Haghiri-Tehrani et al.
patent: 4822989 (1989-04-01), Miyamoto et al.
patent: 4931853 (1990-06-01), Ohuchi et al.

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