Flame retardant epoxy molding compound, method and encapsulated

Details Flame retardant epoxy molding compound, method and encapsulated Flame retardant epoxy molding compound, method and encapsulated

1991-05-22

1992-10-13

Davis, Jenna L.

Stock material or miscellaneous articles

Composite

Of epoxy ether

428417, 428418, 428921, B32B 2738

Patent

active

051549760

ABSTRACT:
An improved flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the polyglycidyl ether of the bromophenol-formaldehyde novolac type, preferably containing at least about 1.0% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of .ltoreq. about 0.8% by weight of the molding compound, and an amount of bismuth trioxide .ltoreq. about 4.0% by weight of the molding compound.
The improved flame retardant epoxy molding compounds when used to encapsulated semiconductor devices have improved high temperature stability and compatibility, ball-lift performance, live-device performance, cost and lower toxicity compared to similar prior art molding compounds.

REFERENCES:
patent: 4042500 (1977-08-01), Tuller
patent: 4150068 (1979-04-01), Taniyama
patent: 4282136 (1981-08-01), Hunt
patent: 4710796 (1987-12-01), Ikeya
Moltzman et al.; "Evolution of Epoxy Encapsulation Compounds for Integrated Circuits: A User's Perspective"; Polymers for High Technology; 1987; pp. 521-536.

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