Semiconductor wafer processing module having an inclined rotatin

Details Semiconductor wafer processing module having an inclined rotatin Semiconductor wafer processing module having an inclined rotatin

1991-05-17

1992-10-13

Chaudhuri, Olik

Metal working

Barrier layer or semiconductor device making

414223, 20429828, 118730, C23C 1308

Patent

active

051547309

ABSTRACT:
A sputtering module incorporated into a wafer processing system includes an evacuatable housing connectable to one or more other evacuatable housings and a wafer handling turret adapted to receive a wafer in horizontal orientation at a load/unload position and rotate the wafer 180.degree. about an inclined axis into vertical orientation at a sputtering position across from a sputtering target. After sputter coating, the wafer handling turret again rotates 180.degree. about the inclined axis to rotatably return the wafer to the horizontal load/unload position, whereupon the wafer is lowered to a horizontal receiving position for subsequent retrieval by an arm extendible into the module from an adjacently situated housing. The wafer handling turret includes three wafer holding rings and a disc-shaped shutter that is rotatably located in front of the target during precleaning.

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