Printed wiring board

Details Printed wiring board Printed wiring board

1979-12-03

1981-12-01

Hess, Bruce H.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

29852, 29885, 174 685, 427 97, 427181, 427195, 428206, 428207, 428334, 428335, 428337, 428901, B05D 512, B32B 324, H05K 105

Patent

active

043037151

ABSTRACT:
A method of fabricating a printed circuit board is disclosed. The method comprises forming a metal substrate having a through-hole pattern. The metal substrate is coated with a dielectric powder having a suitable flow length value to form a dielectric coat on the substrate having a sufficient through-hole edge coverage. The dielectric coated substrate is then treated with a second powder to form a satisfactory topcoat thereon. Electrical circuitry is then formed on the topcoat in conjunction with the through hole pattern.

REFERENCES:
patent: 3140195 (1964-07-01), Nagel
patent: 3377699 (1968-04-01), Dinella et al.
patent: 3446642 (1969-05-01), Webb
patent: 3934334 (1976-01-01), Hanni
patent: 4188415 (1980-02-01), Takahashi et al.
Western Elecric Technical Digest, No. 19, Jul, 1970, p. 23.
Plating, Jan. 1974, pp. 47-52.

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