Methods of manufacturing semiconductor devices

Details Methods of manufacturing semiconductor devices Methods of manufacturing semiconductor devices

1977-01-21

1978-11-14

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29580, 29591, 148175, 148187, 357 59, B01J 1700

Patent

active

041249330

ABSTRACT:
A method of manufacturing a semiconductor device in which a masking layer is formed on part of the surface of a deposited layer of relatively high resistivity polycrystalline semiconductor material present on an insulating layer provided at a surface of a semiconductor body or body part and a relatively low resistivity conductive region having a substantially uniform narrow line width is defined in the polycrystalline layer by effecting a diffusion process to laterally diffuse a doping element into a portion of the polycrystalline layer underlying an edge portion of the masking layer without diffusing the doping element through the insulating layer into the semiconductor body or body part.

REFERENCES:
patent: 3623923 (1971-11-01), Kennedy
patent: 3738880 (1973-06-01), Laker

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