Method for drilling multilayer printed circuit boards

Details Method for drilling multilayer printed circuit boards Method for drilling multilayer printed circuit boards

1991-10-11

1992-10-13

Howell, Daniel W.

Cutting by use of rotating axially moving tool

Processes

Bit detachable

36447434, 408 13, 408 43, B23B 3500

Patent

active

051545462

ABSTRACT:
The invention is directed to a method for drilling multilayer printed circuit boards, and is also directed to a printed circuit board drill for the implementation of this method. When, based on a known measuring procedure, an offset of the interior layers of the printed circuit boards relative to the rated position is identified, the drill spindles must be appropriately adjusted before drilling in order to avoid rejects. This, however, has the disadvantage that respectively only one printed circuit board can be drilled at one time. Contrasting therewith, the invention provides that the seating plate for the printed circuit board of the drill can be designed variable with respect to the drill spindle, so that a plurality of seating plates can now be adjusted independently of one another. As a consequence, the employment of multi-spindle drills becomes possible.

REFERENCES:
patent: 4088417 (1978-05-01), Kosmowski
patent: 4708545 (1987-11-01), Fujii et al.

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