Method of assembly for the application of electronic components

Details Method of assembly for the application of electronic components Method of assembly for the application of electronic components

1991-07-12

1992-10-13

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29740, 29840, 2281802, H05K 330, B23P 1900

Patent

active

051539853

ABSTRACT:
A method of assembling electronic components to a flexible printed circuit in which a component supporting plate is formed of a rigid plastic material with fitted recesses in which the electronic components are seated. The flexible printed circuit is overlayed with an elastomeric pad, and the flexible printed circuit and pad are then sandwiched between the component supporting plate and a counterplate which is similarly made of a rigid plastic material. This presses the conductors of the flexible printed circuit against the contacts of the electronic components seated in the fitted recesses of the aforesaid counterplate.

REFERENCES:
patent: 3614832 (1971-10-01), Chance et al.
patent: 3724068 (1973-04-01), Galli
patent: 3859723 (1975-01-01), Hamer et al.
patent: 3887996 (1975-06-01), Hartleroad et al.
patent: 4224611 (1988-02-01), Hagihara
patent: 4237607 (1980-12-01), Ohno
patent: 4667402 (1987-05-01), Wilde
patent: 4829664 (1989-05-01), Kabeshita et al.
patent: 4941255 (1990-07-01), Bull

Affiliated with

Also associated with

Rating

Method of assembly for the application of electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of assembly for the application of electronic components , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of assembly for the application of electronic components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1292964