Semiconductor integrated circuit device with optical transmit-re

Details Semiconductor integrated circuit device with optical transmit-re Semiconductor integrated circuit device with optical transmit-re

1991-08-14

1993-03-30

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

257 80, 257 84, 257 81, 257 82, 372 50, 385 35, 25022711, 359566, 361393, H01L 3112

Patent

active

051986841

ABSTRACT:
A semiconductor integrated circuit device comprising a plurality of semiconductor packaging substrates arranged parallel to one another, a plurality of semiconductor integrated circuits mounted on each of the semiconductor packaging substrates, a circuit for electrically connecting the semiconductor integrated circuits, an optical signal transmitting circuit, electrically connected to the semiconductor integrated circuits, for converting an electric signal input by the semiconductor integrated circuits to an optical signal and outputting it to another semiconductor packaging substrate, and an optical signal receiving circuit, electrically connected to the semiconductor integrated circuits, for receiving the optical signal output from the semiconductor packaging substrate, converting the optical signal to an electric signal, and outputting the electric signal to the semiconductor integrated circuits.

REFERENCES:
patent: 4720634 (1988-01-01), D'Auria et al.
patent: 5047835 (1991-09-01), Chang
patent: 5051790 (1991-09-01), Hammer
patent: 5093879 (1992-03-01), Bregman et al.
Hornak, "Fresnel Phase Plate Lenses For Through-Wafer Optical Interconnections", Applied Optics, Sep. 1, 1987, vol. 26, No. 17, pp. 3649-3654.
Hornak, "Through-Wafer Optical Interconnection Coupling Characteristics", Electronic Letters, May 26, 1988, vol. 24, No. 11, pp. 714-715.

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