Resin system of phosphorus-containing acrylate, unsaturated comp

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Polymers from only ethylenic monomers or processes of...

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Details

10628729, 522 16, 522103, 523427, 523457, 525481, 525502, 525529, 525531, 525532, 526220, 526222, 526227, C08F22028

Patent

active

058046801

DESCRIPTION:

BRIEF SUMMARY
FIELD OF THE INVENTION

The present invention is directed toward flame resistant reactive resins and, more specifically, to reactive resins that are suitable for covering electronic components that can be cured by UV irradiation which results in flame-resistant covering compositions. Still more specifically, the present invention relates to flame-resistant single-component reactive resins that are suitable for covering or encasing electronic components.


BACKGROUND OF THE INVENTION

Process-friendly, environmentally compatible and flame-resistant reactive resin molded materials are required for covering or encasing electronic components. Both for reasons of processing reliability and from economic considerations, single-component reactive resins which are storage-stable at room temperature for at least three months and can be cured within a short time at relatively mild curing temperatures of, for example, 100.degree. C. are increasingly required. A further requirement of reactive resins which can be employed for this purpose and of the molded materials produced therefrom is a corrosion-free behavior which does not impair the function and therefore the life of a component covered therewith. The flameproofing aimed for should be such that the reactive resin and the molded materials produced therefrom can easily be recycled or at least can be disposed of without problems.
A reactive resin system which comprises phosphorus-containing reactive compounds to improve the flame resistance is known from EP-A 41 24 25. Reaction of a hydroxy-functional phosphorus compound with an organic anhydride gives an acid ester which can be used as a phosphorus-containing hardener component for a two-component reactive resin based on epoxide.
A single-component phosphorus-containing reactive resin system which can be cured under initiation by UV is known from WO 94/10 223. The phosphorus component is the glycidyl ester of a phosphorus-containing acid which, together with the usual epoxy resins and a photoinitiator for a cationic curing process, results in a single-component reactive resin system which shows an adequate storage stability and good corrosion properties.
Phosphorus-containing unsaturated compounds which have been proposed for coating metals and for use as adhesives are known from EP-A 278 029. Alkali metal salts and alkaline earth metal salts are present as catalysts for the thermal curing. This impairs their usefulness for electronic components.
Unsaturated phosphorus-containing carboxylic acid derivatives are known from DE 20 52 569. These can be reacted with other monomers under acid conditions to give copolymers.
A photosensitive resin composition which comprises a phosphate compound having a photopolymerizable unsaturated bond in combination with a heteroaromatic, such as, for example, benzotriazole, is known from DE-A-32 07 504.


SUMMARY OF THE INVENTION

The object of the present invention is therefore to provide another single-component ready-to-use reactive resin which is storage-stable for several months at room temperature, can be cured completely at moderate temperatures of up to about 100.degree. C., and which can easily be processed with the apparatuses customary for casting resins and which can be cured to molded materials which have an adequate flame resistance required for electronic components and which exhibits good corrosion properties.
These objects are achieved according to the invention with a reactive resin system which comprises a phosphorus-containing acrylate, an unsaturated compound which can undergo free radical copolymerization with acrylates and a free radical photoinitiator system.
A number of phosphorus-containing acrylates which can easily be prepared from customary and reactive phosphorus compounds are proposed for the reactive resin system according to the invention.


DETAILED DESCRIPTION OF THE PRESENTLY PREFERRED EMBODIMENTS

The phosphorus-containing acrylates can be combined with commercially available acrylates or epoxy acrylates and a photoinitiator system to give the re

REFERENCES:
patent: 4434278 (1984-02-01), Skiscim
patent: 4663184 (1987-05-01), Hegel
patent: 5095059 (1992-03-01), Kitamura et al.
patent: 5219957 (1993-06-01), Patzschke et al.
WPAT accession No. 81-65167D/36 for Japanese Patent No. 59-90802. Ube Industries KK, Jul. 1981.

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