Semiconductor devices

Details Semiconductor devices Semiconductor devices

1972-10-12

1976-06-29

Wojciechowicz, Edward J.

357 68, 357 71, 317101R, H01L 3902, H01L 2348, H01L 2946, H02B 104

Patent

active

039672964

ABSTRACT:
A semiconductor device in which a top-contact semiconductor body is thermo-electrostatically face down bonded to a vitreous support carrying patterned metallization forming leads registered with the top contacts, and a protective insulative coating is provided over at least portions of the leads to preclude shortcircuiting to exposed portions of the semiconductor body.

REFERENCES:
patent: 3405361 (1968-10-01), Kattner et al.
patent: 3474297 (1969-10-01), Bylander
patent: 3657610 (1972-04-01), Yamamoto et al.

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