Process of preparing a secondary electron emissive coating on th

Details Process of preparing a secondary electron emissive coating on th Process of preparing a secondary electron emissive coating on th

1974-09-20

1976-06-29

Weiffenbach, Cameron K.

Coating processes

Electrical product produced

Electron emissive or suppressive

427 97, 427237, 427252, 427255, 427 91, 427124, B05D 512

Patent

active

039670015

ABSTRACT:
A process of preparing a nickel secondary electron emissive conductive cong along the interior channel walls of a microchannel plate or by continuing the process of preparing a solid nickel conductor channel to provide a conductive panel and the apparatuses resulting therefrom. The microchannel plate is positioned in a heated oven, or deposition chamber, such that heated inert gases are forced through the open channels to stabilize the channel temperature. The temperature is then lowered and a nickel compound gas is mixed with the inert gas. The gas mixture is forced through the channels to decompose the microchannel plate material and deposit a thin nickel coating on the interior channel walls. If a conductive panel is desired, the process is continued until the entire channel is completely filled with nickel.

REFERENCES:
patent: 3160517 (1964-12-01), Jenkin
patent: 3798060 (1974-03-01), Reed et al.

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