Abrading – Machine – Rotary tool
Patent
1997-06-20
1998-09-08
Eley, Timothy V.
Abrading
Machine
Rotary tool
451285, 451287, B24B 500, B24B 2900
Patent
active
058037993
ABSTRACT:
A polishing head for polishing a semiconductor wafer includes a housing, a wafer carrier movably mounted to the housing, and a wafer retainer movably mounted to the housing. The wafer carrier forms a wafer supporting surface, and the wafer retainer is shaped to retain a wafer in place on the wafer-supporting surface. A first fluid actuator is coupled to the wafer carrier to bias the wafer carrier in a selected direction with respect to the housing, and a second fluid actuator is coupled to the wafer retainer to bias the wafer retainer in a second selected direction with respect to the housing. First and second fluid conduits are coupled to the first and second actuators, respectively, such that fluid pressures in the first and second actuators are separately and independently adjustable with respect to one another. Biasing forces on the retainer can thereby be dynamically adjusted with respect to biasing forces on the carrier during the polishing operation.
REFERENCES:
patent: 3579916 (1971-05-01), Boettcher
patent: 3731435 (1973-05-01), Boettcher et al.
patent: 4519168 (1985-05-01), Cesna
patent: 5205082 (1993-04-01), Shendon et al.
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5329734 (1994-07-01), Yu
patent: 5377451 (1995-01-01), Leoni et al.
patent: 5398459 (1995-03-01), Okumura et al.
patent: 5423558 (1995-06-01), Koeth et al.
patent: 5423716 (1995-06-01), Strasbaugh
patent: 5441444 (1995-08-01), Nakajima
patent: 5449316 (1995-09-01), Strasbaugh
patent: 5476414 (1995-12-01), Hirose et al.
patent: 5527209 (1996-06-01), Volodarsky et al.
patent: 5584751 (1996-12-01), Kobayashi et al.
E. Worthington, "New CMP Architecture Addresses Key Process Issues", Solid State Technology, Jan. 1996, pp. 61-62.
Volodarsky Konstantin
Weldon David E.
Banks Derris H.
Eley Timothy V.
OnTrak Systems, Inc.
LandOfFree
Wafer polishing head does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer polishing head, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer polishing head will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1277105