Manufacturing semiconductor devices in which silicon slices or g

Details Manufacturing semiconductor devices in which silicon slices or g Manufacturing semiconductor devices in which silicon slices or g

1974-09-30

1976-06-29

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

29580, 156 17, 252 793, H01L 21306

Patent

active

039665178

ABSTRACT:
Thinning plate-shaped bodies of silicon or germanium, adhered to a glass-plate by chemically etching in an etchant comprising hydrofluoric acid and at least one oxidant, in which, prior to said etching, the etchant is given a content of silicon. This silicon may be added in several forms, for instance as silicon oxide in readily accessible form or by dissolving some elemental silicon. It is further possible for a similar process to use an etchant comprising the above etchant after first use. The method may be used in the manufacture of semiconductor devices.

REFERENCES:
patent: 3677848 (1972-07-01), Stoller et al.
patent: 3716425 (1973-02-01), Davidsohn
patent: 3762973 (1973-10-01), Gabrail
patent: 3844859 (1974-10-01), Roni

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