Orifice plate and method of fabrication

Details Orifice plate and method of fabrication Orifice plate and method of fabrication

1988-03-16

1989-06-13

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

C25D 108

Patent

active

048390011

ABSTRACT:
An orifice plate and method of fabrication are provided in which the plate is constructed of two electroformed layers of metal. Onto a conductive mandrel a first layer of a first metal is electroformed to provide a support layer having a selected hole pattern. The first layer is then plated with a thick layer of a second metal and removed from the conductive mandrel exposing the bottom surface of the first layer. On the exposed bottom surface, a thin second layer of the first metal is electroformed to produce a pattern of holes of a selected smaller cross section in cooperation with the hole pattern of the first layer of the first metal. The thick layer of the second metal is then etched away, producing a thin metal orifice plate having a pattern of small holes of a selected cross section and supported between the holes by an additional, thicker layer of the same metal.

REFERENCES:
patent: 4246076 (1981-01-01), Gardner

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