Method of making high purity copper sputtering targets

Details Method of making high purity copper sputtering targets Method of making high purity copper sputtering targets

1996-12-26

1998-09-08

Ryan, Patrick

Metal fusion bonding

Process

With shaping

228190, 228193, 2282626, B23K 3100

Patent

active

058033424

ABSTRACT:
Described is a method of making high purity copper sputtering target. The method avoids melting and casting and involves stacking segments of high purity copper plates, and heating, forging and annealing to produce a diffusion bonded unitary structure.

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