Method of forming articles by plating

Chemistry: electrical and wave energy – Processes and products

Patent

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Details

C25D 100, C25D 120

Patent

active

044090706

ABSTRACT:
A method of forming an article having a rough surface for being adhesively bonded to a further member includes pressing a discontinuously surfaced layer 12 of electrically conducting material (for example copper powder) onto the surface of an electrically conducting substrate 11 (for example uncured synthetic rubber loaded with carbon black), so that portions of the layer 12 are embedded in the surface. The exposed parts of the layer 12 are then electro-plated with a metal and the substrate is then removed to provide said formed article.

REFERENCES:
patent: 4314892 (1982-02-01), Stevens

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