Metal fusion bonding – Process – Plural diverse bonding
Patent
1975-03-11
1976-06-29
Smith, Al Lawrence
Metal fusion bonding
Process
Plural diverse bonding
228 18, 228 37, 228179, 228180R, 228262, B23K 3102, B23K 108
Patent
active
039661105
ABSTRACT:
An ultrasonic soldering system is described. Electrical and electronic components are assembled in a circuit board with their leads extending through holes in the board. The components are temporarily held in position in the board by means of a solid, solder-compatible, stabilizer material having a melting point below that of solder, which material couples the board and leads to one another. The component leads are then trimmed to finish length, and after trimming, the components are soldered in place utilizing vibratory energy in a body of molten solder. The vibratory energy in the solder scrubs the board and leads removing oxides and allowing wetting, thus eliminating the need for application of fluxes and surface preparation prior to soldering. The stabilizing material is melted and displaced simultaneously with soldering.
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patent: 3158927 (1964-12-01), Saunders
patent: 3388465 (1968-06-01), Johnston
patent: 3616533 (1971-11-01), Heap et al.
patent: 3704515 (1972-12-01), Nelson
patent: 3825994 (1974-07-01), Coleman
patent: 3835531 (1974-09-01), Luttmer
patent: 3888639 (1975-06-01), Hastings et al.
Hollis Engineering, Inc.
Joyce Margaret
Smith Al Lawrence
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