Semiconductor wafers having a shape suitable for thermal treatme

Details Semiconductor wafers having a shape suitable for thermal treatme Semiconductor wafers having a shape suitable for thermal treatme

1990-07-19

1992-04-28

Carroll, J.

357 55, 357 56, H01L 2702, H01L 2906

Patent

active

051092646

ABSTRACT:
A wafer hanger has a rod member and a supporting member. The rod member is inserted into respective notches formed in semiconductor wafers, and then placed on the supporting member. The wafer hanger holding the wafers is put into a furnace for heat treatment of the wafers. Since the wafers are hung from the rod member, plastic deformation due to the gravity of the wafers is not caused in the wafers.

REFERENCES:
patent: 4965653 (1990-10-01), Otsuka et al.
S. Magdo, "Pyramid Shaped Electrical Feedthrough in Silicon Wafers", IBM Technical Disclosure Bulletin, vol. 19, Sep. 1976, pp. 1232-1233.

Affiliated with

Also associated with

Rating

Semiconductor wafers having a shape suitable for thermal treatme does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor wafers having a shape suitable for thermal treatme, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor wafers having a shape suitable for thermal treatme will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1251996