Printed circuit board with filled throughholes

Details Printed circuit board with filled throughholes Printed circuit board with filled throughholes

1990-01-26

1991-07-02

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174265, 174 35R, H05K 900

Patent

active

050287435

ABSTRACT:
A double sided or multi-layered printed circuit board comprises an insulating substrate having conductors on opposed major surfaces thereof which are electrically connected together via a through-hole. A sealing member composed of conductive resin fills the through-hole. An insulating layer covers the conductors and sealing member, and an electronic wave-shielding layer covers the insulating layer.

REFERENCES:
patent: 4383363 (1983-05-01), Hayakawa et al.
patent: 4649461 (1987-03-01), Matsuta
patent: 4791248 (1988-12-01), Oldenettel
McDermott, C. J. Face Protection of Printed Circuit Boards, IBM Technical Disclosure Bulletin; vol. 11, No. 7, Dec. 1968.

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