Coating processes – Direct application of electrical – magnetic – wave – or... – Polymerization of coating utilizing direct application of...
Patent
1993-08-27
1994-06-14
Pianalto, Bernard
Coating processes
Direct application of electrical, magnetic, wave, or...
Polymerization of coating utilizing direct application of...
4272553, 4272556, 4272557, 4274071, 427489, 427495, 427539, 427571, 427578, 427585, 427598, B05D 306
Patent
active
053208757
ABSTRACT:
A method of preparing a coated substrate is disclosed. The substrate is coated with a plasma generated polymer containing Si, Or C and H in specific atom ratio wherein the polymer also contains certain functional groups, A power density of about 10.sup.6 to about 10.sup.8 J/Kg is employed in the plasma polymerization process.
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The Structure of Organosilicon Plasma-Polymerized Coatings on Metal Substrates I. H. Coopes and H. J. Griesser, Journal of Applied Polymer Science, vol. 37, 3413-3422 (1989).
Hu Ing-Feng
Tou James C.
Kanuch Bruce M.
Pianalto Bernard
The Dow Chemical Company
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