Thermosetting resin composition

Details Thermosetting resin composition Thermosetting resin composition

1989-08-02

1991-07-02

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523440, 524300, 524394, 524413, 524430, 524443, 524493, 524606, 524607, C08K 322, C08K 334, C08L 7908

Patent

active

050286412

ABSTRACT:
A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a powdery inorganic filler. The composition has excellent heat resistance as well as superb mechanical properties at high temperature not to mention room temperature, and is expected to find wide-spread commercial utility in electric and electronic components such as sealing materials, sockets and connectors and other applications.

REFERENCES:
patent: Re29316 (1977-07-01), Bargain et al.
patent: 3129105 (1964-04-01), Berry et al.
patent: 3658764 (1972-04-01), Bargain et al.
patent: 3669930 (1972-06-01), Asahara et al.
patent: 3830777 (1974-08-01), Burton
patent: 4065345 (1977-12-01), Progar et al.
patent: 4075171 (1978-02-01), D'Alelio
patent: 4076697 (1978-02-01), Forgo et al.
patent: 4393177 (1983-07-01), Ishii et al.
patent: 4433104 (1984-02-01), Giles, Jr.
patent: 4435560 (1984-03-01), Takahashi
patent: 4526838 (1985-07-01), Fujioka et al.
patent: 4599396 (1986-07-01), Takekoshi et al.
patent: 4725642 (1988-02-01), Gannett et al.
patent: 4737568 (1988-04-01), Stenzenberger
patent: 4831102 (1989-05-01), Yamaya
Katz, Handbook of Fillers and Reinforcements; 1978, pp. 144-145.

Affiliated with

Also associated with

Rating

Thermosetting resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermosetting resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermosetting resin composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1247675