Method of monitoring constituents in plating baths

Details Method of monitoring constituents in plating baths Method of monitoring constituents in plating baths

1992-11-17

1994-06-14

Niebling, John

Chemistry: electrical and wave energy

Processes and products

Processes of treating materials by wave energy

204402, 204412, 204434, 204435, G01N 2726

Patent

active

053207246

ABSTRACT:
A method of monitoring a plating bath which combines ac and dc voltammetry to accurately measure major and trace constituent concentrations. The method involves applying both ac and dc voltammetric signals to a pretreated electrode in contact with the plating bath solution, measuring the ac and dc response current spectra, and comparing the resultant spectra to determine which provides maximum spectral detail for monitoring particular constituents with minimum interference from other constituents. Then, the ac and dc response current spectra are each used to monitor the particular constituents for which each provides the best accuracy. The method complements and is easily integrated with known voltammetric techniques and equipment.

REFERENCES:
patent: 4631116 (1986-12-01), Ludwig

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