Cleaning apparatus

Brushing – scrubbing – and general cleaning – Machines – Wiping

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Details

15 882, 15 211, 15 77, B08B 1102, A46B 1304

Patent

active

061484636

ABSTRACT:
The cleaning apparatus of the present invention comprises a cleaning member 105 adapted to be rotated while maintaining contact with a surface of a semiconductor wafer W, to thereby clean the surface of the semiconductor wafer W, and a drive motor 50 for rotating the cleaning member 105. A linear bushing 75 and coil springs 81 are provided between the cleaning member 105 and the drive motor 50. The linear bushing 75 ensures that the cleaning member 105 is capable of slidably moving in a direction of an axis of rotation. The coil springs 81 ensure that the cleaning member 105 applies a predetermined pressure to the semiconductor wafer W. A pressure in a casing 1 [(1-1), (1-2) and (1-3)] is set to a negative pressure relative to an outside air pressure by suction through a pipe 111.

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patent: 5860178 (1999-01-01), Nishimura et al.
patent: 5860181 (1999-01-01), Maekawa et al.
patent: 5901403 (1999-05-01), Yang
patent: 5956791 (1999-09-01), Bassi et al.

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