Method and apparatus for cold wall chemical vapor deposition

Coating apparatus – Gas or vapor deposition – With treating means

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118724, 118715, 392411, 392416, 392418, 219390, 219411, C23C 1600

Patent

active

RE0369578

ABSTRACT:
A CVD reactor includes a vacuum chamber having first and second thermal plates disposed therein and two independently-controlled multiple-zone heat sources disposed around the exterior thereof. The first heat source has three zones and the second heat source has two zones. A wafer to be processed is positioned below the first thermal plate and immediately above the second thermal plate, thereby being indirectly heated from above by the first heat source via the first thermal plate and indirectly heated from below by the first zone of the second heat source via the second thermal plate. A thermal ring plate which laterally surrounds the edge of the wafer absorbs heat energy emitted from the second zone of the second heat source and heats the outer edge of the wafer. First and second sensors embedded in the first thermal plate and the thermal ring plate, respectively, measure and provide the respective temperatures thereof to a computer which, in response thereto, adjusts power to the three zones of the first heat source and the two zones of the second heat source to maintain the first thermal plate and the thermal ring plate, respectively, at a constant temperature. In this manner, a uniform temperature is maintained across the wafer.

REFERENCES:
patent: 3830194 (1974-08-01), Benzing
patent: 4125391 (1978-11-01), Van Laethem
patent: 4493977 (1985-01-01), Arai
patent: 4503807 (1985-03-01), Nakayama et al.
patent: 4533820 (1985-08-01), Shimizu
patent: 4817558 (1989-04-01), Itoh
patent: 4828224 (1989-05-01), Crabb et al.
patent: 4836138 (1989-06-01), Robinson
patent: 4854263 (1989-08-01), Chang
patent: 4920918 (1990-05-01), Adams
patent: 4958061 (1990-09-01), Wakabayashi et al.
patent: 4993358 (1991-02-01), Mahawili
patent: 5000113 (1991-03-01), Wang
patent: 5085887 (1992-02-01), Adams
patent: 5113929 (1992-05-01), Nakagawa
patent: 5148714 (1992-09-01), McDiarmid
patent: 5156820 (1992-10-01), Wong
patent: 5179677 (1993-01-01), Anderson
patent: 5198034 (1993-03-01), Deboer et al.
patent: 5215588 (1993-06-01), Rhieu
patent: 5269847 (1993-12-01), Anderson
patent: 5305417 (1994-04-01), Najm
patent: 5414244 (1995-05-01), Imahashi
patent: 5444815 (1995-08-01), Lee
patent: 5445675 (1995-08-01), Kubodera
patent: 5446825 (1995-08-01), Moslehi
patent: 5487127 (1996-01-01), Gronet
patent: 5970213 (1999-10-01), Cord et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for cold wall chemical vapor deposition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for cold wall chemical vapor deposition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for cold wall chemical vapor deposition will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1245970

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.